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SECO COMe-B75-CT6

COM Express™ Compact 3.0 Type 6 Module with the AMD Ryzen™ Embedded V1000 processors
COMe-B75-CT6 is a COM Express™ Compact Type 6 with the AMD Ryzen™ Embedded V1000 processors designed by SECO mounting up to 4 Zen x86 CPU cores with the latest Radeon graphics and I/O controller on a single chip. It comes with up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory, a wide range of expansion ports, PCI-Express, Serial Ports, networking and video interfaces, all of which makes it an ideal solution for medical devices, digital signage, and gaming.
Industria / Módulos
Kiosk
Medicina
Seguridad
Transporte

Specifications

Processor
AMD Ryzen™ Embedded V1807B with AMD Radeon™ Vega 11 Graphics, Quad Core Dual Thread @ 3.35GHz (3.8 Boost), TDP 35-54W 
AMD Ryzen™ Embedded V1756B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 3.25GHz (3.6 Boost), TDP 35-54W 
AMD Ryzen™ Embedded V1605B with AMD Radeon™ Vega 8 Graphics, Quad Core Dual Thread @ 2.0GHz (3.6 Boost), TDP 12-25W 
AMD Ryzen™ Embedded V1202B with AMD Radeon™ Vega 3 Graphics, Dual Core Dual Thread @ 2.3GHz (3.2 Boost), TDP 12-25W
AMD Ryzen™ Embedded V1404I with AMD Radeon™ Vega 3 Graphics, Quad Core / Single Thread, TDP 15W ,Industrial Temperature range (to be released) 
Max Cores		 4
Memory		 Up to two DDR4 SO-DIMM Slots supporting DDR4-3200 ECC Memory (DDR4-2400 with V1605B, V1202B and V1404I)
Graphics

AMD Radeon™ Vega GPU with up to 11 Compute Units 
DirectX® 12 supported 
H.265 (10-bit) decode and 8-bit video encode
VP9 decode 
4 independent displays supported
Video Interfaces

3 x Digital Display Interfaces (DDIs), supporting DP 1.3, DVI and HDMI 1.4/2.0 
eDP or Single/Dual-Channel 18-/24- bit LVDS interface
Video Resolution

DDIs, eDP: up to 4K
LVDS: up to 1920 x 1200
Mass Storage		 2 x S-ATA Gen3 Channels
Networking

Gigabit Ethernet interface 
Intel® I21x family GbE Controller 
USB		 4 x USB 3.0 Host ports
8 x USB 2.0 Host ports
PCI-e

Up to 4x PCI-e x1 Gen3 lanes + 2 x PCI-e x1 Gen2 ports
PCI-express Graphics (PEG) x 8 Gen3
Audio		 HD Audio Interface
Serial Ports

2 x UARTs
Other Interfaces

SPI, I2C bus, SM Bus, LPC bus, FAN management 
LID#/SLEEP#/PWRBTN#, Watchdog 
4x GPI, 4 x GPO
Power Supply

+12VDC ± 10% and + 5VSB (optional)
Operating System

Microsoft® Windows 10 
Linux Ubuntu
Operating Temperature

0°C  ÷ +60 °C (Commercial version)
-40°C ÷ +85°C (Industrial version)

 

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.
Dimensions		 95 x 95 mm (Com Express™ Compact Form factor, Type 6 pinout)

Order information


Part number Description
MB75-3001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1202B @ 2.5GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp
MB75-4001-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Packet Switch - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp
MB75-4001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1605B @ 2.0GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp
MB75-6001-2111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I211 - EDP Port - HUB - Packet Switch - Comm. Temp
MB75-6002-1111-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I210 - EDP Port - HUB - Comm. Temp
MB75-6002-1211-C0 COMe-B75-CT6 w/AMD Ryzen Embedded V1807B @ 3.35GHz - Ethernet Contr. I210 - EDP Port - HUB - TPM - Comm. Temp