Utilizamos cookies propias y de terceros para ofrecer nuestros servicios y recoger datos estadísticos. Continuar navegando implica su aceptación. Más información Aceptar
Módulos
«Volver

Asrock COM-653

- COM Express (4.95-in x 3.74-in) ntel 8th Generation Intel® Core™ Processor BGA 1440Intel® Xeon® Processor E-2100M- I7-8850H, 6C, 2.6GGHz, 45W- I5-8400H, 4C, 2.5GHz, 45W- I3-8100H, 4C, 3GHz, 45W- E-2176M, 6C, 2.7GHz, 45W (optional) Intel® 8th Generation Intel® Core™ Processor BGA 1440Intel® Xeon® Processor E-2100MSupports Dual Channel DDR4 SO-DIMM 2666MHz up to 32GB2 x DDI channels, 1 x eDP(shared with LVDS)4 x USB 3.1, 8 x USB 2.0, 4 x SATA31 x Intel® LAN1 x TPM2.0 on board IC (optional)
Módulos
  • USB
    USB

Specifications

Dimensions

- COM Express (4.95-in x 3.74-in)

CPU

ntel 8th Generation Intel® Core™ Processor BGA 1440Intel® Xeon® Processor E-2100M- I7-8850H, 6C, 2.6GGHz, 45W- I5-8400H, 4C, 2.5GHz, 45W- I3-8100H, 4C, 3GHz, 45W- E-2176M, 6C, 2.7GHz, 45W (optional)

Chipset

- Intel® QM370- IntelCM246 ( optional )- IntelHM370 ( Non-AMT )

PCIe

- 1 x PCIe x16, 1 x PCIe x8

Technology

- Dual Channel DDR4 2666MHz

Max.

- 32GB

Socket

- 2 x SO-DIMM

ECC Support

- Yes (Intel® Xeon)

SATA

- 4 x SATA3 (6.0Gb/s)

USB

- 8 x USB 2.0, 4 x USB 3.1

GPIO

- 4 x GPO + 4 x GPI

TPM

- TPM2.0 on board IC (optional)

Others

- LPC, SMBus, I2C, SPI , FAN , WDT

Interval

- 256 segments, 0,1,2…255sec

Input PWR

- ATX: 12V/5Vsb, or AT: 8~20V

Temperature

- 0ºC – 60ºC

Operating Temp

- 0ºC – 60ºC

Storage Temp

- -40ºC – 85° C

Operating Humidity

- 5% ~ 90%

Storage Humidity

- 5% ~ 90%