Utilizamos cookies propias y de terceros para ofrecer nuestros servicios y recoger datos estadísticos. Continuar navegando implica su aceptación. Más información Aceptar
Digital Signage / Módulos
«Volver

KARO QSXM-MM60

The new QSXM Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29mm and a height of 2.6mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 108 pads. The ground pad additionally acts as thermal pad.

Embedded computing power is very much in demand in a growing number of multimedia-centric devices. The Ka-Ro QS8M is ideally suited for target markets requiring high-end devices for powerful images and impressive video streaming creating connected devices in the following vertical markets.
By combining the power-efficient processing capabilities of the ARM Cortex-A53 architecture with bleedingedge 3D and 2D graphics, the i.MX 8M Mini/Nano provides a new level of multimedia performance to enable an unbounded next-generation user experience.

QFN Style Solder-Down Computer On Module
• QSX – extended 2nd generation QS module series
• QS pin-compatible
• Solder-down version
• 29mm square
• 2.6mm total height
• QFN type lead style
     ◦ 1mm pitch
     ◦ 108 pads
     ◦ Thermal pad
• Visual solder joint inspection possible after soldering
• Single-sided assembly
• 3.3V-5V power supply (-5%/+10%)
Digital Signage / Módulos
Industria
Medicina
Transporte
  • ARM
    ARM
  • LAN
    LAN
  • Serie
    Serie
  • USB
    USB
  • Rango extendido de temperatura
    Rango extendido de temperatura
  • Windows
    Windows

QSXM Facts
Processor NXP i.MX 8M Mini
Cores Quad Cortex®-A53, 1.6 GHz
RAM 2 GB LPDDR4
Flash 4 GB eMMC
Extra features compared to QS8M PCIe, LPDDR4, 3.3-5V power supply
Temperature -25 °C to 85 °C
Dimensions (LxWxD) 29 mm x 29 mm x 2.6 mm
Datasheets  QSXM

Key Features
• NXP i.MX 8M Mini Quad Cortex-A53 up to 1.6 GHz
                                               Cortex-M4 up to 400 MHz
• RAM 2 GB LPDDR4 • ROM 4 GB eMMC • Grade Industrial
• Temperature -25°C to 85°C
• Display support
◦ MIPI DSI (4-lane)
◦ GC328 2D GPU
◦ GCNanoUltra 3D GPU
◦ 1080p60 video de-/encode
• Connectivity
◦ 2x USB 2.0
◦ 1x Gb Ethernet, RGMII
◦ 1x eMMC/SD
◦ 1x PCIe® Gen 3, 1-lane
◦ 4x UART, 3x I²C, 2x SPI, 4x PWM, SAI
◦ Up to 60x 3.3V General Purpose I/O

OS Support
• Linux
• Windows 10 IoT