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Digital Signage / Módulos


The new QSXP Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29mm and a height of 2.6mm is single-sided assembled. Its QFN type lead style has a 1mm pitch with 108 pads. The ground pad additionally acts as thermal pad.

Embedded computing power is very much in demand in a growing number of multimedia-centric devices. The Ka-Ro QS8M is ideally suited for target markets requiring high-end devices for powerful images and impressive video streaming creating connected devices in the following vertical markets.

The i.MX 8M Plus family focuses on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. It is built to meet the needs of Smart Home, Building, City and Industry 4.0 applications.

  • Powerful quad or dual Arm® Cortex®-A53 processor with a Neural Processing Unit (NPU) operating at up to 2.3 TOPS.
  • Dual Image Signal Processors and two camera inputs for an effective Vision System.
  • The multimedia capabilities include video encode (including h.265) and decode, 3D/2D graphic acceleration, and multiple audio and voice functionalities.
  • Real-time control with Cortex-M7. Robust control networks supported by dual CAN FD and dual Gigabit Ethernet with Time Sensitive Networking (TSN).
  • High industrial reliability with DRAM inline ECC and ECC on on-chip RAM.

QSX-Series - QFN Style Solder-Down Computer On Module
• QSX – extended 2nd generation QS module series
• QS pin-compatible solder-down version
• 29mm square
• 2.6mm total height
• QFN type lead style
     ◦ 1mm pitch
     ◦ 108 pads
     ◦ Thermal pad
• Visual solder joint inspection possible after soldering
• Single-sided assembly
• 3.3V-5V power supply (-5%/+10%)

Digital Signage / Módulos
  • LAN
  • Linux
  • Serie
  • USB
  • Rango extendido de temperatura
    Rango extendido de temperatura

QSXP Facts
Processor NXP i.MX 8M Plus
Cores Quad Cortex®-A53, 1.6 GHz
Flash 8 GB eMMC
Temperature -30 °C to 85 °C
Dimensions (LxWxD) 29 mm x 29 mm x 2.6 mm
Datasheets  QSXP

Key Features

• NXP i.MX 8M Plus Quad Cortex-A53 up to 1.6 GHz
                                               Cortex-M7 up to 800 MHz
• Grade Industrial
• Temperature -30°C to 85°C
• Display support
◦ MIPI DSI (4-lane)
◦ GC520L 2D GPU
◦ GC7000UL 3D GPU
◦ 1080p60 video de-/encode
• Vision and Machine Learning
◦ 2x MIPI-CSI (4-lane each)
◦ Dual Camera ISP (2x HD/1x 12MP) HDR, dewarp
◦ Machine Learning Accelerator: 2.3 TOPS
◦ Tensilica® HiFi4 DSP up to 800 MHz
• Connectivity
◦ 1x USB 3.0, 1x USB 2.0
◦ 1x Gb Ethernet with IEEE®1588, AVB, TSN
◦ 1x eMMC/SD, 2x CAN-FD
◦ 1x PCIe® Gen 3 – 1-lane
◦ 3x UART, 2x I²C, 2x SPI, PWM, SAI
◦ Up to 60x 3.3V General Purpose I/O

OS Support
• Linux