Karo QSXP-ML81
Our new QSXP Series is a QFN Style Solder-Down Computer On Module. The module with a small square size of 29 mm and a height of 2.6 mm is single-sided assembled. Its QFN type lead style has a 1 mm pitch with 108 pads. The ground pad additionally acts as a thermal pad.
- NXP i.MX 8M Plus
- Quad Cortex-A53 up to 1.6 GHz
- Cortex-M7 up to 800 MHz
- RAM
- 2 GB LPDDR4
- ROM
- 8 GB eMMC
- Grade
- Industrial
- Temperature
- -30°C to 85°C
- Display support
- MIPI DSI (4-lane)
- GC520L 2D GPU
- GC7000UL 3D GPU
- 1080p60 video de-/encode
- Vision and Machine Learning
- 2x MIPI-CSI (4-lane each)
- Dual Camera ISP (2x HD/1x 12MP) HDR, dewarp
- Machine Learning Accelerator: 2.3 TOPS
- Tensilica® HiFi4 DSP up to 800 MHz
Smart City / Módulos
-
ARM
-
Interfaz
-
Linux
-
USB
-
Rango extendido de temperatura
Specifications
| QSXP Facts | |
|---|---|
| Processor | NXP i.MX 8M Plus |
| Cores | Quad Cortex®-A53, 1.6 GHz |
| RAM | 2 GB LPDDR4 |
| Flash | 8 GB eMMC |
| Temperature | -30 °C to 85 °C |
| Dimensions (LxWxD) | 29 mm x 29 mm x 2.6 mm |
| Datasheets | QSXP |
Connectivity
1x USB 3.0, 1x USB 2.0
1x Gb Ethernet with IEEE®1588, AVB, TSN
1x eMMC/SD, 2x CAN-FD
1x PCIe® Gen 3 – 1-lane
3x UART, 2x I²C, 2x SPI, PWM, SAI
Up to 60x 3.3V General Purpose I/O
OS Support
Linux