Seco SBC-C66-mITX

Intel® 8th generation Core™ / Xeon® (formerly Coffee Lake H) CPUs:

• Intel® Core™ i7-8850H, Six Core @ 2.6GHz (4.3GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with HyperThreading
• Intel® Core™ i5-8400H, Quad Core @ 2.5GHz (4.2GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with HyperThreading
• Intel® Core™ i3-8100H, Quad Core @ 3.0GHz, 6MB Cache, 45W TDP (35W cTDP)
• Intel® Xeon® E-2176M, Six Core @ 2.7GHz (4.4GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with HyperThreading

Intel® 9th generation Core™ / Xeon® / Pentium® / Celeron® (formerly Coffee Lake Refresh) CPUs:

• Intel® Xeon® E-2276ME Six Core @2.8GHz (4.5GHz Max 1 Core Turbo), 12MB Cache, 45W TDP (35W cTDP), with Hyperthreading
• Intel® Xeon® E-2276ML Six Core @2.0GHz (4.2GHz Max 1 Core Turbo), 12MB Cache, 25W TDP, with Hyperthreading
• Intel® Xeon® E-2254ME Quad Core @2.6GHz (3.8GHz Max 1 Core Turbo), 8MB Cache, 45W TDP (35W cTDP), with Hyperthreading
• Intel® Xeon® E-2254ML Quad Core @1.7GHz (3.5GHz Max 1 Core Turbo), 8MB Cache, 25W TDP, with Hyperthreading
• Intel® Core™ i7-9850HE,  Six Core @2.7GHz (4.4GHz Max 1 Core Turbo), 9MB Cache, 45W TDP (35W cTDP), with Hyperthreading
• Intel® Core™ i7-9850HL, Six Core @1.9GHz (4.1GHz Max 1 Core Turbo), 9MB Cache, 25W TDP, with Hyperthreading
• Intel® Core™ i3-9100HL, Quad Core @1.6GHz (2.9GHz Max 1 Core Turbo), 6MB Cache, 25W TDP
• Intel® Pentium® G5600E, Dual Core @2.6GHz (3.1GHz Max 1 Core Turbo), 4MB Cache, 35W TDP
• Intel® Celeron® G4930E, Dual Core @2.4GHz, 2MB Cache, 35W TDP
• Intel® Celeron® G4932E,  Dual Core @1.9GHz, 2MB Cache, 25W TDP

2x DDR4-2666 or 4x DDR4-2444 ECC SODIMM Slots, up to 128GB total (only with 4 SODIMM modules). 
ECC DDR4 memory modules supported only with Xeon® Core™ i3, Pentium® and Celeron® CPUs combined with CM246 PCH

Intel® UHD Graphics 630/P630 architecture, up to 48 Execution Units
Up to 3 independent displays supported
DirectX 12, OpenGL 4.5, and OpenCL 2.1 support
HW accelerated video decode MPEG2, VC1/WMV9, AVC/H.264, VP8, JPEG/MJPEG, HEVC/H.265 (8-/10-bit), VP9
HW accelerated video encode MPEG2, AVC/H.264, VP8, JPEGHEVC/H.265, VP9

2x DP++ connector
eDP 40-poles connector (interface switched with LVDS)
LVDS Single/Dual Channel connector (interface switched with eDP)

DP++, eDP: up to 4096x2304 @ 60Hz, 24bpp
LVDS: up to 1920x1200 @ 60Hz

Up to 2x S-ATA M 7p standard connectors
M.2 Socket 3 Key M 2280 Slot for NVME SSD modules with PCI-ex4 or SATA interface
M.2 Socket 2 Key B Slot for SATA SSD modules (interface shared with PCI-e x2)
microSD card slot

Up to 2x Gigabit Ethernet interface (Intel® I219-LM GbE PHY + optional Intel® I210/211 GbE controller)
M.2 Socket1 Key E 2242 Slot for optional WLAN modules
M.2 WWAN Slot (PCI-e x2 interface shared with SATA SSD module)

2x USB 3.1 ports on standard Type-A sockets, placed on the front side of the board.
4x USB 3.1 (Superspeed + USB 2.0) ports on a PCIe/104 Connector for Expansion
1x USB 3.1 (Superspeed + USB 2.0) port on M.2 SSD/WWAN Key B Slot
2x USB 2.0 ports on standard Type-A sockets, placed on the front side of the board.
2x USB 2.0 ports on internal pin header
1x USB 2.0 port on M.2 Socket 1 Key E for WiFi modules

PCI-e x4 interface on M.2 Socket 3 Key M slot for NVMe modules
PCI-e x2 port on M.2 SSD/WWAN Key B Slot
PCI-e x1 port on M.2 Socket 1 Key E for WiFi modules
4x PCI-e x1 ports on PCIe/104 Connector for Expansion
PCI-e x8 port on Network Card Adapter Slot
2x PCI-e x4 ports on PCI-e/104 Connector for Expansion

HD Audio codec on-board
Mic In, Line out audio jacks
Front Panel Audio Header

2x multistandard RS-232/RS-422/RS-485 serial ports on internal pin header

LPC pin Header
Front Panel Header
3-pin or 4-pin tachometric FAN Connector
Optional TPM 2.0 device on-board

2-pin Mega-Fit connector
VIN Range: +12V+24V

Windows 10 64-bit
Linux OS 64-bit

0°C  ÷ +60 °C (Commercial version)

*Measured at any point of SECO standard heastpreader for this product, during any and all times (including start-up). Actual temperature will widely depend on application, enclosure and/or environment. Upon customer to consider application-specific cooling solutions for the final system to keep the heatspreader temperature in the range indicated.

170 x 170 mm (mini-ITX form factor)