Utilizamos cookies propias y de terceros para ofrecer nuestros servicios y recoger datos estadísticos. Continuar navegando implica su aceptación. Más información Aceptar
Comunicación / Sistemas
«Volver

Vecow ECX-3000

Powered by 12th generation 16-core Intel® Core™ i9/i7/i5/i3 processor (Alder Lake) with Intel® 600 Series chipset, fanless -40°C to 75°C operating temperature, multiple 10G LAN/2.5G LAN/GigE LAN/SIM socket configuration, max 6 USB 3.2 Gen 2 connections supporting up to 10Gbps data rate, outstanding system performance, 5G/WiFi 6/4G/3G/LTE/GPRS/UMTS mobile availability, 9V to 50V power input. Software ignition power control and rugged reliability in harsh environments, all-in-one integrated features, Vecow ECX-3000 Series Fanless Embedded System is your new generation choices for Machine Vision, In-vehicle Computing, Public Security, Factory Automation, Intelligent Transportation System (ITS), Robotic Control, AMR/AGV, Deep Learning, and any Edge AI applications.

The Latest Edge AI Accelerator 

  • The latest 12th Gen Intel Core i9/i7/i5/i3 processor running with Intel 600 series Chipset (former codename : Alder Lake-S), up to 65W TDP CPU supported
  • Breakthrough core technology features performance hybrid architecture supporting up to 16 cores and 24 threads outstanding Multi Threaded performance with Intel Thread Director      
  • Intel UHD Graphics 770 driven by Intel® Xe Architecture with up to 32 graphics execution units (EUs) to support AI workload parallelization   
  • High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), 10GigE LAN (10G), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G)


The Latest Edge AI Accelerator 

  • The latest 12th Gen Intel Core i9/i7/i5/i3 processor running with Intel 600 series Chipset (former codename : Alder Lake-S), up to 65W TDP CPU supported
  • Breakthrough core technology features performance hybrid architecture supporting up to 16 cores and 24 threads outstanding Multi Threaded performance with Intel Thread Director      
  • Intel UHD Graphics 770 driven by Intel® Xe Architecture with up to 32 graphics execution units (EUs) to support AI workload parallelization   
  • High-speed data transfer : PCIe 4.0 (16GT/s), USB 3.2 Gen 2 (10G), 10GigE LAN (10G), SATA III (6G), 2.5GigE LAN (2.5G), GigE LAN (1G)
Comunicación / Sistemas
Digital Signage
Gaming
Industria
Kiosk
Medicina
Seguridad
Smart City
Transporte
  • 4G
    4G
  • 5G
    5G
  • Intel
    Intel
  • LAN
    LAN
  • Linux
    Linux
  • POE
    POE
  • Serie
    Serie
  • USB
    USB
  • Rango extendido de temperatura
    Rango extendido de temperatura
  • Wifi
    Wifi
  • Windows
    Windows

System
Processor 12th Gen Intel® Core™ i9/i7/i5/i3 Processor (Alder Lake-S)
Chipset Intel® 600 Series Chipset
BIOS AMI
SIO IT8786E
Memory 2 DDR4 3200MHz SO-DIMM, up to 64GB (ECC/Non-ECC)
OS Windows 10, Linux
I/O Interface
Serial  Up to 4 COM RS-232/422/485
USB 6 USB 3.2 Gen 2
Isolated DIO 16 Isolated DIO : 8 DI, 8 DO (Optional)
LED Power, HDD, PoE, Wireless
SIM Card  2 External SIM Card Sockets
RTC Battery Front-access RTC Battery
Expansion
Mini PCIe 1 Mini PCIe Socket for PCIe/USB/SIM Card/Optional mSATA
M.2
- 1 M.2 Key B Socket (3042/3052)
- 1 M.2 Key E Socket (2230)
SUMIT A, B 2 SUMIT Slot (Optional)
Graphics
Graphics Processor Intel® UHD Graphics 770 driven by Intel® Xe Architecture
Interface
- 2 DisplayPort : Up to 7680 x 4320 @60Hz/5120 x 2880 @60Hz
- 1 DVI-I : Up to 1920 x 1080 @60Hz
- 1 HDMI : Up to 4096 x 2160 @60Hz
Storage
SATA 2 SATA III (6Gbps) support S/W RAID 0, 1
mSATA 1 SATA III (Mini PCIe Type, 6Gbps)
M.2 1 M.2 Key M Socket (2280, PCIe x4)
Storage Device
- Front-access 2.5" SSD/HDD Tray
- 4 Front-access M.2 Key M SSD Tray (ECX-3000 PoES)
Audio
Audio Codec Realtek® ALC888S-VD, 7.1 Channel HD Audio
Audio Interface 1 Mic-in, 1 Line-out
Ethernet
LAN 1 Intel® I219LM GigE LAN
LAN 2 Intel® I225 2.5GigE LAN supports TSN
PoE 
LAN 3 to LAN 6 2.5GigE IEEE 802.3at (25.5W/48V) PoE+ by Intel® I225

Power
Power Input DC 9V to 50V
Power Interface
- 3-pin Terminal Block : V+, V-, Frame Ground
- 4-pin Mini-DIN 
Ignition Control 16-mode Software Ignition Control
Remote Switch 3-pin Terminal Block 
Others
TPM Infineon SLB9670 supports TPM 2.0, SPI Interface
Watchdog Timer Reset : 1 to 255 sec./min. per step
Smart Mgmt. Wake on LAN, PXE supported
HW Monitor Monitoring temperature, voltages. Auto throttling control when CPU overheats.
Mechanical
Dimension 260.0mm x 175.0mm x 79.0mm (10.24" x 6.89" x 3.11")
Weight 3.8 kg (8.38 lb)
Mounting
- Wallmount by mounting bracket
- DIN Rail Mount (Optional)
- 2U Rackmount (Optional)
Environment
Operating Temperature
35W TDP CPU :
-40°C to 75°C (-40°F to 167°F), Fanless
65W TDP CPU :
-40°C to 55°C (-40°F to 131°F), Fanless
2.5G Series : 
-40°C to 70°C (-40°F to 158°F), Fanless
10G  Series : 
0°C to 50°C (32°F to 122°F), with Internal Fan
Storage Temperature -40°C to 85°C (-40°F to 185°F)
Humidity 5% to 95% Humidity, non-condensing
Relative Humidity 95% @75°C
Shock
- IEC 60068-2-27
- SSD : 50G @wallmount, Half-sine, 11ms
Vibration
- IEC 60068-2-64
- SSD : 5Grms, 5Hz to 500Hz, 3 Axis
EMC CE, FCC, EN50155, EN50121-3-2